Alice & Bob Posted 30+ days ago

3D Integration Engineer

Location

Paris

Hybrid

Contract

Permanent

Full-time

Salary

Not disclosed

Experience

3+ years

Mid-level level

What they're looking for

PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test-vehicle design through experiments, data analysis, and…
Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus